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SmarcSOM-SF-RZ/G2L
Renesans MPU

Starting from 49 USD

Description

The new SmarcSOM-SF-RZ/G2L is compliant with SMARC 2.1.1. The module family is equipped with cost-effective and power-efficient RZ/G2UL ARM Cortex-A55 processors, manufactured by Renesas. The module integrates a single-core ARM Cortex-A55 processor running at 1.0 GHz, an ARM Cortex-M33 real-time processor and an Image Processing Unit to support entry level HMI applications. The typical design power ranges from 2 to 4 W.

The module is featuring high computation power. The option is fully certified Wi-Fi (802.11a/b/g/n) and Bluetooth (BLE 5.1) module. This module simplifies the carrier board design and is ideally suited for wireless application. The SmarcSOM-SF-RZ/G2L provides a variety memory configuration, including flexible range of DDR4 and eMMC Flash memory and arious interfaces for embedded applications such as Gigabit Ethernet, USB 2.0, dual CAN-FD, MIPI DSI for display and MIPI CSI-2 for connecting a camera are available. An on-board Wireless Module is provided as assembly options.

The module allows easy integration with SMARC carrier boards. For evaluation and design-in of the SmarcSOM-SF-RZ/G2L module, Somteq Evaluation Kit and accessories for rapid development. Support for Linux is available.

Specifications

Overview
CPU Up to 1.2GHz Dual Cortex-A55 Renesas RZ/G2L
Certified WiFi/BT 802.11 1X1 a/b/g/n/ac + BT/BLE5.2
High Speed Interfaces 2x USB2.0, 2x GbE
Multimedia H.264 Enc/Dec 1920 x 1080 @ 30 fps
OS Support Linux, FreeRTos
Som Factor Smarc 2.1 (Short Factor)
Compatible Carrier Board SmarcCB-SF-Light
Product Longevity 2032
CPU
CPU Name Renesas RZ/G2L
CPU Type Cortex™-A55
CPU Cores 2 Cores
CPU Clock (Max) Up to 1.2GHz
Real-time co-processor 200 MHz Cortex™-M33
Multimedia
GPU ARM Mali-G31
VPU H.264 Enc/Dec 1920 x 1080 @ 30 fps
Camera Interfaces MIPI-CSI2 - 4 lane
Display Interface MIPI-DSI – 4 lane (1920 × 1080)
Audio I2S
Connectivity
SD / MMC -
USB Host / Device USB2.0: 2x OTG
UART x4
I2C x4
SPI x1
RTC 1 (optional battery backup on carrier board)
JTAG x1
QSPI x1
Ethernet 2x 10/100/1000 Mbps
Wi-Fi 802.11 1X1 a/b/g/n/ac
Bluetooth BT/BLE 5.2
Memory
RAM 1-2 GB DDR4
eMMC 4-128 GB
Physical
Temperature range -40 to 85°C
Som size (W x L) 82 x 50 mm
Power Supply 5V
Digtial I/O Voltage 1,8V
Wi-Fi Connector uFL
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SmarcEVK-SF-RZ/G2L
Evaluation kit

Evaluation Kit is designed to be a flexible development environment to explore and evaluate the functionality and performance of the Smarc 2.1 SOM product family. All interfaces on the Carrier Board can be easily accessed, through a combination of real world connectors and easily accessible, standard pitch headers. The breakout area allows easy probing of a large number of cb interfaces and easy access to break and jumper signals as needed

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Documentation

REFERENCE MANUAL

OPERATING SYSTEMS

MECHANICAL

OTHER

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